Surface mounting of printed circuit boards is the installation of components on the surface of the board by soldering the SMD component to the contact pad. Advantages:
the possibility of manufacturing double-sided boards
the absence of the usual conclusions reduces their size and weight
increasing the density of the layout due to the small size of the electric elements
improving electrical parameters due to the layout
facilitating the repair of boards, it is easier to clean the contact pads from the flux
the process is easy to automate
reducing the cost of products in mass production
Manual DIP installation
Output mounting of printed circuit boards is the installation of electronic components, in which the terminals of the elements pass through the through holes of the board. The contacts are soldered to the metallized layer in the holes and firmly fixed in them. Advantages:
allows you to mount boards of any complexity reliable solder of all contacts in metallized holes
reduced risk of overheating of components, their damage and peeling
the possibility of soldering leads to the inner layers of the plate
eliminates machine defects associated with unforeseen depletion of supplies of consumables
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Contact information
Kazakhstan, Almaty, Nursultan Nazarbayev avenue, house 65, office 503